12-Layer TU-872 SLK High-Speed Low-Loss PCB is a high-reliability multilayer circuit board based on premium TG200 modified FR-4 substrate. This high-speed PCB caters to high-frequency circuit design, high-precision impedance matching, and low-latency signal transmission scenarios for modern computing, networking, and telecommunication electronic systems. Adopting advanced TU-872 SLK low-dielectric material stacking structure, the board delivers stable electrical performance, minimal signal loss, and superior thermal and mechanical durability for high-layer-count multilayer applications.
This custom 12-layer PCB features a professional dual copper thickness structure: 1oz outer copper layers for stable high-current conduction and robust signal transmission, and 0.5oz inner copper layers to support ultra-fine line routing and high-density layout. The finished board thickness reaches 1.68mm, with a standard dimension of 155mm × 79.5mm (1 piece including process edges). It applies high-reliability immersion gold surface finish, paired with matte green solder mask and clear white silkscreen to ensure oxidation resistance, stable solderability, and precise component marking. All through holes adopt full resin plugging and electroplating filling structure. Supported by strict multi-layer impedance control across TOP, L3, L5, L10, and L12 layers, this TU-872 SLK PCB maintains excellent signal integrity with ultra-low transmission loss and consistent impedance accuracy.
Precise Multi-Layer Impedance Control Specifications
This 12-layer high-speed PCB supports strict customized impedance matching for single-ended and differential signals on key signal layers. Accurate line width and spacing design eliminate signal reflection, crosstalk, and waveform distortion, fully meeting high-speed circuit integrity requirements:
TOP Layer: 90Ω impedance control; 100Ω differential (4.9mil/5.5mil); 50Ω single-end (7mil)
Layer 3: 90Ω impedance control; 100Ω differential (4.5mil/4.7mil); 50Ω single-end (6mil)
Layer 5: 100Ω differential (5mil/6mil); 50Ω single-end (9mil)
Layer 10: 85Ω impedance control (8mil line width)
Layer 12: 100Ω differential (5mil/5mil); 50Ω single-end (7mil)
What Is TU-872 SLK? High-Speed Low-Loss Modified FR-4 Material
TU-872 SLK is a high-performance modified epoxy FR-4 laminate with woven E-glass fiber, tailored for high-speed, low-loss, and high-frequency multilayer PCB designs. It offers low dielectric constant (Dk ＜ 4.0) and ultra-low dissipation factor (Df ＜ 0.010), maintaining stable Dk/Df performance across broad frequency ranges to minimize high-speed signal attenuation, delay and waveform distortion.
Optimized with unique allyl network compounds, TU-872 SLK outperforms conventional FR-4 materials with lower Z-axis thermal expansion, excellent moisture resistance, chemical stability and CAF resistance. Fully compatible with standard FR-4 processes and lead-free reflow, it suits high-layer-count PCB production with high thermal stability and reliable through-hole performance, acting as a cost-effective low-loss substrate for commercial high-speed and high-frequency electronic applications.
12-Layer TU-872 SLK High Speed PCB Specifications
| Parameter Item | Detailed Specification |
| PCB Layer Count | 12-layer high-speed low-loss multilayer PCB |
| Base Material | TG200 high-performance TU-872 SLK modified low-loss FR-4 |
| Finished Board Thickness | 1.68mm |
| Copper Thickness | Outer layer: 1oz; Inner layer: 0.5oz |
| Surface Treatment | Immersion Gold for stable conductivity and long-term oxidation resistance |
| Solder Mask & Silkscreen | Matte green solder mask with white silkscreen |
| Board Dimension | 155mm × 79.5mm, 1 piece (with process edges) |
| Key Processes | Full through-hole resin plugging & electroplating filling; precise multi-layer impedance control |
| Impedance Control Layers | TOP, L3, L5, L10, L12 single-ended & differential impedance matching |
| Material Characteristics | Low Dk/Df, high Tg, low CTE, anti-CAF, moisture resistant, FR-4 process compatible |
| Quality Standard | IPC-Class-2 qualified, lead-free assembly compatible |
12-Layer TU-872 SLK PCB stack-up
TU-872 SLK Typical Application Fields
Radio Frequency Systems: High-frequency signal transceiving and processing boards for low-latency RF equipment
High Performance Computing & Storage: Server mainboards, line cards, backpanels, and high-speed storage circuit modules
Telecom & Base Station Hardware: Communication base station control boards, signal processing and transmission units
Network Routing Devices: High-speed industrial switches, office routers, and broadband terminal equipment
High-Speed Multilayer Electronics: High-layer-count PCBs for high-frequency, high-temperature, and high-humidity working environments
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TU-872 SLK High-Speed PCB High TG Multilayer Board Images
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